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Author Qinghong He ♦ Smith, S. ♦ Guohua Xiong
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2011
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Temperature measurement ♦ Temperature sensors ♦ Electronic packaging thermal management ♦ Thermal conductivity ♦ Conductivity ♦ Measurement errors ♦ epoxy attachment ♦ Thermocouple ♦ thermocouple attachment ♦ temperature measurement error
Abstract Thermocouples have been widely used in electronics thermal measurement. Although there are many ways to attach a thermocouple to an electronic component, epoxy especially rapid bonding epoxy material has been the favorable choice due to its convenience of use. However there remains lack of comprehensive understanding of the accuracy of the measurement results and what should be done to minimize the error introduced by the thermocouple and epoxy. In this study two parameters were introduced to describe the causes of error in thermocouple measurement using epoxy. A total of eight variables that may occur in the epoxy attachment were investigated based upon a numerical experiment setup, which consisted of a detailed replication of an actual thermocouple and a typical electronic component thermal model. Different combinations along with their measurement errors were provided for side by side comparison. The measurement error could be as high as 25 ∼ 40% in some cases and even for the best case scenario it was still above 4% in this study. The quick-dry epoxy is practically good enough for most electronic thermal measurements, but attentions must be paid to control several variables that can be commonly neglected in order to assure results are acceptable. The findings from this study can be applied by thermal engineers to achieve the best practice during thermal design and measurement.
Description Author affiliation: NetApp, Inc., 495 East Java Dr, Sunnyvale, CA 94089 (Guohua Xiong) || Jabil Circuit, Inc., 10800 Roosevelt Blvd N, St Petersburg, FL 33716 (Qinghong He; Smith, S.)
ISBN 9781612847405
ISSN 10652221
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2011-03-20
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
e-ISBN 9781612847368
Size (in Bytes) 463.07 kB
Page Count 12
Starting Page 280
Ending Page 291

Source: IEEE Xplore Digital Library