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Author Cheong Yew Wee ♦ San, T.B.
Sponsorship Mems Technol.(M) Sdn, Bhd ♦ Kriptic Devices (M) Sdn Bhd ♦ IEEE Electron Devices Soc
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2002
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Rough surfaces ♦ Surface roughness ♦ Temperature measurement ♦ Wheels ♦ Feeds ♦ Optical materials ♦ Process control ♦ Surface emitting lasers ♦ Interferometry ♦ Residual stresses
Abstract Wafer thinning operation parameters such as grit size of grinding wheel, spindle speed, grinding chuck rotation speed, feed rate, grinding tape material, and wafer handling mechanism become more critical as the market is driving thinner wafers. The input parameter of the thinning process control the surface roughness and the residual damage. In this study, the relationship between grits size and surface roughness was investigated using UBM Laser-Profilometer. Warpage was measured at different temperatures using Infrared Fizeau Interferometry. It was shown that bigger grit causes higher surface roughness and surface roughness is directly related with surface damage, stress and warpage.
Description Author affiliation: Bayan Lepas Free Indus. Zone, Intel Technol. Sdn Bhd, Penang, Malaysia (Cheong Yew Wee)
ISBN 0780375785
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2002-12-19
Publisher Place Malaysia
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 312.90 kB
Page Count 6
Starting Page 163
Ending Page 168


Source: IEEE Xplore Digital Library