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Author Maize, K. ♦ Xi Wang ♦ Kendig, D. ♦ Shakouri, A. ♦ French, W. ♦ O'Connell, B. ♦ Lindorfer, P. ♦ Hopper, P.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2009
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Power transistors ♦ Fingers ♦ Temperature distribution ♦ Power integrated circuits ♦ MOSFETs ♦ Voltage ♦ Thermal factors ♦ Temperature dependence ♦ FETs ♦ Thermal engineering ♦ thermoreflectance ♦ Power transistors ♦ power arrays ♦ Power ICs ♦ LDMOS ♦ semiconductor heating ♦ thermal imaging
Abstract Thermal performance is an important factor in the design of power devices. Previous studies have shown that nonuniform temperature distributions occur in both small transistors [1,2,3] and in large area power transistor devices [4,5,6]. We present extensive thermal characterization of large scale transistor arrays that are typical in power applications. Thermal images using the thermoreflectance technique as well as thermocouple data are presented for the device under both low and high current conditions. Thermal characterization is obtained for load currents up to 4 amperes and current densities up to $45A/mm^{2}$ in the power arrays. Temperature nonuniformity in the arrays is studied as a function of array size, bias level, and ambient temperature. Increased heating is shown to develop near the source contact region in the arrays.
Description Author affiliation: Baskin School of Engineering, University of California Santa Cruz, USA (Maize, K.; Xi Wang; Kendig, D.; Shakouri, A.) || National Semiconductor, Santa Clara, CA, USA (French, W.; O'Connell, B.; Lindorfer, P.; Hopper, P.)
ISBN 9781424436644
ISSN 10652221
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2009-03-15
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
e-ISBN 9781424436651
Size (in Bytes) 441.74 kB
Page Count 5
Starting Page 50
Ending Page 54


Source: IEEE Xplore Digital Library