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Author Edwards, D.L. ♦ Hering, R.L. ♦ Long, D.C. ♦ Singh, S.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2006
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Assembly ♦ Cooling ♦ Thermal resistance ♦ Thermal conductivity ♦ Circuits ♦ Copper ♦ Multicore processing ♦ Multichip modules ♦ Thermal expansion ♦ Silicon carbide
Abstract Some recent IBM UNIX servers use multi-chip modules (MCMs) with multi-core processor chips with very high power densities, requiring aggressive thermal solutions. The thermal solution includes flip chips with individually attached heat spreaders. Because of the difficulty of reworking the thermal solution, and the high value of the module at the time the cooling solution is assembled, very high assembly yields were required. This drove new technologies, and new processes to enable assembly of highly efficient cooling structures with very high yields. This paper addresses the challenges of assembling the heat spreader cooling solution, and describes how these challenges were overcome
Description Author affiliation: IBM Server & Technol. Group, Hopewell Junction, NY (Edwards, D.L.)
ISBN 1424401534
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2006-03-14
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 726.68 kB
Page Count 5
Starting Page 157
Ending Page 161

Source: IEEE Xplore Digital Library