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Author Bhopte, Siddharth ♦ Sammakia, Bahgat ♦ Calmidi, Varaprasad
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2008
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Flip chip ♦ Thermal resistance ♦ Electronic packaging thermal management ♦ Temperature ♦ Thermal conductivity ♦ Copper ♦ Heat transfer ♦ Testing ♦ Cold plates ♦ Power dissipation
Abstract This paper describes a systematic experimental and numerical study of the thermal characterization of a flip-chip package. A cold-plate based test method is used for thermal characterization and internal thermal resistance is used as the basis of all comparisons. Experiment results are presented for three flip-chip packages. Test parameters such as thermocouple wire, attachment, thickness of interface material (grease) between the package lid and the cold plate and power dissipation are presented. Using a detailed numerical model [1], of the package, a parametric study of the experimental method is presented. The parametric study shows the variation in package thermal resistance due to different thermocouple bead sizes, thermocouple attachment parameters, different thermal grease thicknesses and different chip-lid thermal interface material (TIM) properties. All the numerically predicted values are within the experimental range.
Description Author affiliation: Endicott Interconnect Technologies, Inc., Binghamton, NY, 13902, USA (Calmidi, Varaprasad) || State University of New York at Binghamton, USA (Bhopte, Siddharth; Sammakia, Bahgat)
ISBN 9781424417001
ISSN 10879870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2008-05-28
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 193.42 kB
Page Count 8
Starting Page 302
Ending Page 309

Source: IEEE Xplore Digital Library