Thumbnail
Access Restriction
Subscribed

Author Roy, S.K. ♦ Avanic, B.L.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2003
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Cold plates ♦ Power electronics ♦ Heat sinks ♦ Trigeneration ♦ Resistance heating ♦ Electronic components ♦ Electronics cooling ♦ Contact resistance ♦ Prototypes ♦ Testing
Abstract A liquid cooled heat sink/cold plate for electronic components with high heat flux and high heat dissipation requirements has been proposed. The convective resistance of the heat sink is minimized by combining jet impingement cooling together with high velocity flows in narrow gaps. An integrated pumping capability ensures that the caloric resistance is low and permits direct contact cooling in order to eliminate contact and conduction resistances. A prototype heat sink has been fabricated and tested in order to evaluate its performance. Experimental results show that the normalized resistance of the heat sink, based on the heated area, can be more than 50% lower than those of conventional liquid cooled heat sinks. The results also suggest that further improvements in performance are feasible.
Description Author affiliation: PhD Res. Group, Inc, Coral Gables, FL, USA (Roy, S.K.; Avanic, B.L.)
ISBN 0780377931
ISSN 10652221
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2003-03-11
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 294.21 kB
Page Count 5
Starting Page 231
Ending Page 235


Source: IEEE Xplore Digital Library