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Author Baker, G.H. ♦ Gordon, C.R.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1989
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics
Subject Keyword Protection ♦ Standards development ♦ Radiation hardening ♦ US Department of Defense ♦ Electromagnetic radiation ♦ Electromagnetic shielding ♦ Electromagnetic transients ♦ Apertures ♦ EMP radiation effects ♦ Communication system control
Abstract A brief summary is presented of US Department of Defense (DOD) efforts for standardizing a high electromagnetic pulse (HEMP) radiation hardening approach for critical fixed ground-based command, control, and communication and intelligence (FGBC/sup 3/I) facilities. The approach adopted by DOD for hardening FGBC/sup 3/I facilities is called the low-risk hardening approach. This approach relies principally upon an electromagnetic barrier to prevent unacceptable electrical transients from reaching potentially vulnerable system components. The barrier consists of (1) an electromagnetic shield (steel or copper) which fully encloses all mission-critical components, and (2) treatment of each electrical penetration of the shield and each aperture in the shield to attenuate the transmission of conducted transients adequately. The number of shield penetrations and apertures is strictly controlled to facilitate validation testing. The low-risk hardening approach is illustrated. The hardening approach will be promulgated in MIL-STD-188-125 scheduled to appear in early 1990.<<ETX>>
Description Author affiliation: US Defense Nucl. Agency, Washington, DC, USA (Baker, G.H.; Gordon, C.R.)
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1989-05-23
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 162.27 kB
Page Count 2
Starting Page 52
Ending Page 53


Source: IEEE Xplore Digital Library