Thumbnail
Access Restriction
Subscribed

Author Kowalski, L. ♦ Jimenez, V. ♦ Dominguez-Pumar, M. ♦ Gorreta, S. ♦ Silvestre, S. ♦ Castaner, L.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2013
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Mars ♦ Heating ♦ Atmospheric measurements ♦ Temperature measurement ♦ Temperature sensors ♦ Terrestrial atmosphere ♦ Atmospheric modeling
Abstract A novel spherically shaped thermal anemometer for low pressure, Mars-like conditions, is described. The concept has been designed using finite element multyphysics simulations to find out the thermal conductance to the ambient for varying conditions of wind speed and direction and ambient pressure and temperature. A prototype 1cm diameter suitable to work under these environment in the range 0.25-10m/s speed has been build using 3D printing and tested inside a low pressure chamber. The protopype shown has two separated hemispheres, independently heated above the ambient temperature, providing angle sensitivity in one plane. Measurements of the heating power in both hemispheres required to keep an overheat of 30K are shown as a function of the wind direction showing good sensitivity at 0.5m/s. One improvement of this sensor is the means provided to also heat the core of the sphere where the circuit board is located thereby avoiding most of the conduction losses to the supports. The concept is scalable to other wind speed and pressure conditions and also to full 3D measurements.
Description Author affiliation: Dept. d'Eng. Electron. (DEE), Univ. Politec. de Catalunya (UPC), Barcelona, Spain (Kowalski, L.; Jimenez, V.; Dominguez-Pumar, M.; Gorreta, S.; Silvestre, S.; Castaner, L.)
ISBN 9781467346429
ISSN 19300395
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2013-11-03
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 408.00 kB
Page Count 4
Starting Page 1
Ending Page 4


Source: IEEE Xplore Digital Library