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Author Funk, J.N. ♦ Menguc, M.P. ♦ Tagavi, K.A. ♦ Cremers, C.J.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1991
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Printed circuits ♦ Temperature distribution ♦ Electronic packaging thermal management ♦ Steady-state ♦ Thermal conductivity ♦ Thermal resistance ♦ Eigenvalues and eigenfunctions ♦ Computer interfaces ♦ Concurrent computing ♦ Distributed computing
Abstract A fast, easy-to-use method is developed to predict steady state temperatures on printed circuit boards subjected to heating by a single heat source or multiple heat sources. The method includes separate analytical solutions for the circuit board and for the chips to be mounted on the board. The board solution is developed using the Green's function method for solving the heat diffusion equation in the board. For the chip, the solution of the heat diffusion equation is obtained using the method of separation of variables. The temperature solution for the package is determined using an iterative procedure between the chip model and the board model. The method is verified by comparison with detailed finite element techniques. The agreement between the temperature distributions predicted by the two methods is very good.
Description Author affiliation: Dept. of Mech. Eng., Kentucky Univ., Lexington, KY, USA (Funk, J.N.; Menguc, M.P.; Tagavi, K.A.; Cremers, C.J.)
ISBN 0879426640
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1991-02-12
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 609.25 kB
Page Count 8
Starting Page 7
Ending Page 14

Source: IEEE Xplore Digital Library