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Author Jui-Hung Chien ♦ Ruei-Siang Hsu ♦ Hsueh-Ju Lin ♦ Ka-Yi Yeh ♦ Shih-Chieh Chang
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2014
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword Image segmentation ♦ Testing ♦ Feature extraction ♦ Clustering algorithms ♦ Classification algorithms ♦ Heating ♦ Thermal Analysis ♦ 3D-IC ♦ Interposer ♦ Testing
Abstract A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detect a defective interposer from the thermal image after heating the interposer. We propose to extract special features from the thermal image and then use a clustering algorithm to determine whether the interposer is defective. Experimental results show that our testing mechanism can efficiently improve the yield from 70.5% to 96.84%.
Description Author affiliation: Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan (Jui-Hung Chien; Ruei-Siang Hsu; Hsueh-Ju Lin; Shih-Chieh Chang) || Inf. & Commun. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan (Ka-Yi Yeh)
ISBN 9781479930173
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2014-06-01
Publisher Place USA
Rights Holder Association for Computing Machinery, Inc. (ACM)
Size (in Bytes) 0.98 MB
Page Count 6
Starting Page 1
Ending Page 6


Source: IEEE Xplore Digital Library