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Author Ozawa, S. ♦ Yoshida, K. ♦ Okamoto, H. ♦ Saijo, K.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2001
Language English
Subject Domain (in DDC) Technology ♦ Manufacturing
Subject Keyword Sheet materials ♦ Bonding ♦ Etching ♦ Plasma temperature ♦ Chemical processes ♦ Surface cleaning ♦ Argon ♦ Plasma applications ♦ Plasma materials processing ♦ Manufacturing processes
Abstract A new cladding process has been developed by means of a surface activated bonding technique. The metal sheets to be bonded are cleaned by Ar plasma ion etching activated and rolled with low distortion at room temperature in vacuum. In many respects, the clad sheets manufactured by this process have advantages over conventional clad sheets. For instance, they have a clean and flat interface without intermetallic alloy layer. Thin metal foil (10 /spl mu/m/spl sim/thickness) can be bonded with the metal sheet. The multi layer clad sheet produced by this process can be formed easily by selective chemical etching method Therefore, the sheet makes it possible to design a fine and solid conductive circuit with bump only through the chemical etching process.
Description Author affiliation: Toyo Kohan Co. Ltd., Yamaguchi, Japan (Ozawa, S.)
ISBN 0769512666
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2001-12-11
Publisher Place Japan
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 525.89 kB
Page Count 4
Starting Page 1032
Ending Page 1035

Source: IEEE Xplore Digital Library