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Author Iwasaki, H. ♦ Sasaki, T. ♦ Ishizuka, M.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1994
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Multichip modules ♦ Thermal resistance ♦ Space cooling ♦ Equations ♦ Friction ♦ Heat transfer ♦ Heat sinks ♦ Ducts ♦ Performance analysis ♦ Numerical analysis
Abstract Numerical and experimental studies were carried out to evaluate the air cooling characteristics of plate fins for MCMs (multichip modules) with and without some spanwise space around the plate fins. The flow field in-between the plate fins can be assumed to be similar to that of a parallel plate duct, and hence two dimensional laminar flow analyses using the finite volume method were performed. Calculations were carried out for Res (S/L)=1 to 200 and S/t (plate spacing to plate thickness ratio)=3, 4 and 7. Some empirical equations for the Nusselt number and friction factor based on the numerical results are proposed. Considering the fin efficiency calculated from the conventional conduction fin model, the thermal resistance of the plate fins with no space around the fins could be estimated easily on the basis of the above-mentioned equations. Comparisons with experimental results show that this method is valid for H/S (fin height to plate spacing ratio)/spl ges/7. In the case of H/S=4, the thermal resistance is overestimated by this method. Furthermore, nodal network analyses were carried out to estimate the thermal resistance of the plate fin including some spanwise space by specifying the cooling characteristics of the plate fin with no space around the fin. The good agreement between the predicted results and corresponding experimental data shows that this relatively simple nodal network method is quite useful to estimate the thermal resistance of plate fills including some spanwise space.
Description Author affiliation: Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan (Iwasaki, H.; Sasaki, T.; Ishizuka, M.)
ISBN 0780313720
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1994-05-04
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 356.49 kB
Page Count 4
Starting Page 144
Ending Page 147


Source: IEEE Xplore Digital Library