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Author Price, D.C. ♦ Schmidt, R.
Sponsorship Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2004
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Military computing ♦ Telecommunication computing ♦ Military communication ♦ Military equipment ♦ Electronic equipment ♦ Electronic packaging thermal management ♦ Thermal management ♦ Chip scale packaging ♦ Thermal management of electronics ♦ Packaging machines
Abstract The electronic design community is facing a new phase of thermal challenges in the present and future electronic and optical packaging. It is very common to have localized high-heat-flux components located within the system in direct proximity to other components, which are very sensitive to temperature. This is especially true when the system contains both optical and electronic devices. The current trend of using system-on-chip packaging often results in high-heat-flux devices within the system. On the other hand, the present and next generation of civilian and military electronic equipment needs to be able to accommodate high- heat-fluxes in the same given physical space as equipment developed in the 1990s. Appropriate thermal management techniques need to be introduced, which will satisfy the reliability, maintainability, and availability of the system. In addition, these techniques must be economically acceptable. This panel will address the limitations of the air-cooling, the extension of the air-cooling limits through unique air-cooling technologies, refrigeration cooling, liquid cooling, liquid immersion cooling, and two-phase cooling.
Description Author affiliation: Raytheon Electronics (Price, D.C.)
ISBN 0780383575
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2004-06-01
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 105.73 kB
Page Count 2
Starting Page 709
Ending Page 710


Source: IEEE Xplore Digital Library