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Author Hua Ye ♦ Basaran, C. ♦ Hopkins, D. ♦ Cartwright, A.
Sponsorship Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) ♦ K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME ♦ Electron. & Photonics & Packaging Div. (EPPD), ASME ♦ Int. Microelectron. & Packaging Soc. (IMAPS)
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2002
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Soldering ♦ Capacitive sensors ♦ Electromigration ♦ Integrated circuit packaging ♦ Strain measurement ♦ Power electronics ♦ Electronics packaging ♦ Lead ♦ Electric variables measurement ♦ Stress measurement
Abstract Damage mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored. In this paper, the state-of-the-art research on electromigration in solder joints is reviewed. An experimental electromigration study on solder joints is conducted and results are reported in this paper. The strain field in the solder joints under electrical stressing is measured with Moire Interferometry technique.
Description Author affiliation: UB Electron. Packaging Lab., State Univ. of New York, Buffalo, NY, USA (Hua Ye)
ISBN 0780371526
ISSN 10899870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2002-05-30
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 537.75 kB
Page Count 7
Starting Page 946
Ending Page 952

Source: IEEE Xplore Digital Library