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Author Rahmani, Y. ♦ Shokouhmand, H.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2012
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Heating ♦ Abstracts ♦ Thermal conductivity ♦ Conductivity ♦ Materials ♦ Thermal resistance ♦ Temperature-Dependent Thermal Conductivity ♦ Thermal Spreading Resistance ♦ Isotropic Half-Space ♦ Heat Flux Tube
Abstract Thermal spreading or constriction resistances exist whenever heat flows from one region to another in different cross sectional areas. In this study, the ideas of Isotropic half-space and Heat flux tube are numerically modeled in order to estimate the thermal spreading/constriction resistance. Furthermore, the thermal spreading resistances of the Silicon in arbitrary temperature and heat flux ranges are calculated for assessing the temperature-dependent thermal conductivity effects. Finally, different sizes of contact area in the Heat flux tube pattern are used to obtain the effect of contact size on the thermal spreading/constriction resistance. Results clearly indicate that the thermal spreading/constriction resistance is affected by the temperature-dependent conductivity of solids, shape of contact surface, size of contact and boundary conditions.
Description Author affiliation: Young Researchers Club, Takestan Branch, Islamic Azad University, Iran (Rahmani, Y.) || Mechanical Engineering Department, University of Tehran, Iran (Shokouhmand, H.)
ISBN 9781424495337
ISSN 10879870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2012-05-30
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
e-ISBN 9781424495320
Size (in Bytes) 2.43 MB
Page Count 5
Starting Page 482
Ending Page 486


Source: IEEE Xplore Digital Library