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Author Noda, S. ♦ Miyamoto, M. ♦ Horibe, H. ♦ Oya, I. ♦ Kuzumoto, M. ♦ Kataoka, T.
Sponsorship IEEE Electron Devices Soc.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2001
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Resists ♦ Substrates ♦ Inductors ♦ Plasma temperature ♦ Chemical processes ♦ Glass ♦ Surface texture ♦ Spectroscopy ♦ Surface cleaning ♦ Surface treatment
Abstract A resist stripping process using highly-concentrated ozone gas and water vapor has been developed This method features higher removal rate and/or an eco-friendly process, compared with conventional methods. Influences of substrate temperature, water vapor concentration, anti residence time, on the removal rate have been experimentally investigated in detail. An FT-IR spectroscope was used to analyze the substrate before/after the treatment in order to clarify the mechanism of the resist stripping by ozone and water vapor It is shown that water plays an important role in the resist decomposition. Main factor of higher removal rate over 1 /spl mu/m/min in this method is also discussed.
Description Author affiliation: Mitsubishi Electr. Corp., Hyogo, Japan (Noda, S.)
ISBN 0780367316
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2001-10-08
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 422.73 kB
Page Count 4
Starting Page 233
Ending Page 236


Source: IEEE Xplore Digital Library