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Author Yi-Kan Cheng ♦ Sung-Mo Kang
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1996
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Circuit simulation ♦ Very large scale integration ♦ Electrothermal effects ♦ Timing ♦ Computational modeling ♦ Temperature distribution ♦ Thermal stresses ♦ Steady-state ♦ Analytical models ♦ Semiconductor device modeling
Abstract In this paper, we present a fast thermal reliability diagnosis tool (iTHREAD) for CMOS VLSI chips. Unlike existing circuit-level electrothermal simulators, it finds the steady-state temperature distribution, the hot spots, as well as the resulting power consumptions in an extremely efficient way. By using a fast timing simulator with accurate temperature-dependent device models and a novel 3-D analytical thermal simulator, it can easily handle very large circuits. With iTHREAD, temperature-dependent reliability and timing problems of VLSICs can be accurately and quickly predicted. It can be further applied to guide the module placement, timing verification, and many other IC reliability diagnoses.
Description Author affiliation: Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA (Yi-Kan Cheng; Sung-Mo Kang)
ISBN 0780331176
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1996-05-05
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 419.43 kB
Page Count 4
Starting Page 479
Ending Page 482


Source: IEEE Xplore Digital Library