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Author Asada, S. ♦ Obata, S. ♦ Tsuruhara, M.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2006
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Cleaning ♦ Furnaces ♦ Semiconductor films ♦ Delay effects ♦ Delay lines ♦ National electric code ♦ Dry etching ♦ Semiconductor devices ♦ Fluid flow ♦ Temperature control
Abstract It is necessary to clean the furnace tube utilizing etching gas after several deposition cycles of LPCVD poly-Si process. But the total cleaning time is uncertain factor, because the etching rate of the deposited film varied with the deposition condition, and it leads to the extension of over- etching time. In this paper, we established the novel cleaning method utilizing the detection of the endpoint of cleaning, even though the amount of the deposited film is unknown.
Description Author affiliation: NEC Fabserve Ltd., Sagamihara (Asada, S.; Obata, S.; Tsuruhara, M.)
ISBN 9784990413804
ISSN 1523553X
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2006-09-25
Publisher Place Japan
Rights Holder ISSM
Size (in Bytes) 1.28 MB
Page Count 2
Starting Page 401
Ending Page 402


Source: IEEE Xplore Digital Library