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Author Burdick, W. ♦ Daum, W.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1994
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Multichip modules ♦ Fabrication ♦ Research and development ♦ Manufacturing ♦ Integrated circuit interconnections ♦ Dielectric substrates ♦ Testing ♦ Inspection ♦ Packaging ♦ Microwave technology
Abstract In order to attain the high yields that are a must for every MCM manufacturer, components used in the fabrication of MCMs must be screened for visual and performance defects. As GE CRD and other MCM manufacturers continue efforts to improve MCM yields, a proven IC pretest methodology for affecting high, first-pass MCM yield has been established by GE CRD. This paper presents the approach, as developed and implemented in the absence of an industry accepted "Known Good Die" process, based on GE CRD's experience of screening components after wafer level test. Using this pretest methodology, it has been shown that high MCM yields can be achieved through a combination of Military Standard 883 2010A visual inspection and minimal IC pretest, without need for burn-in.
Description Author affiliation: Corp. Res. & Dev., Gen. Electr. Co., Schenectady, NY, USA (Burdick, W.; Daum, W.)
ISBN 0780321030
ISSN 10893539
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1995-10-02
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 851.43 kB
Page Count 11
Starting Page 30
Ending Page 40


Source: IEEE Xplore Digital Library