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Author Guo, X. ♦ Celo, D. ♦ Gunupudi, P. ♦ Khazaka, R. ♦ Walkey, D.J. ♦ Smy, T. ♦ Nakhla, M.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2004
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Electronic components ♦ Reduced order systems ♦ Boundary conditions ♦ Predictive models ♦ Multidimensional systems ♦ Numerical models ♦ Resistors ♦ Displays ♦ Temperature ♦ Electronics packaging
Abstract This paper presents a new approach to create boundary condition independent thermal compact models based on the multidimensional model reduction (MDMR) technique. A methodology is developed for the generation of a multi dimensional compact model (MDCM) from a detailed numerical model. The MDCM is shown to have a number of advantages over resistor network models. The generation of the model is at least an order of magnitude faster then the creation of an optimized network model. The MDCM displays very high accuracy typically better than 0.1%, is very flexible allowing for the prediction of all internal temperatures, and presents no limitations on the external configuration of the compact model. A generic multi-chip module ball grid array (MCMBGA) package is used to demonstrate the technique. The MDCM created shows to have high predictive capability, boundary condition independence and a small model size. Finally, by connecting the MDCM to a printed circuit board model and simulating the system, speed ups of around 100 times are achieved.
Description Author affiliation: Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada (Guo, X.; Celo, D.; Gunupudi, P.; Khazaka, R.; Walkey, D.J.; Smy, T.; Nakhla, M.)
ISBN 078038363X
ISSN 10652221
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2004-03-11
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 622.81 kB
Page Count 7
Starting Page 104
Ending Page 110

Source: IEEE Xplore Digital Library