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Author Goth, G.F. ♦ Arvelo, A. ♦ Eagle, J. ♦ Ellsworth, M.J. ♦ Marston, K.C. ♦ Sinha, A.K. ♦ Zitz, J.A.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2012
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Cold plates ♦ Assembly ♦ Water heating ♦ Manifolds ♦ Servers
Abstract Back in 2008 IBM reintroduced water cooling technology into its high performance computing platform, the Power 575 Supercomputing node/system. Water cooled cold plates were used to cool the processor modules which represented about half of the total system (rack) heat load. An air-to-liquid heat exchanger was also mounted in the rear door of the rack to remove a significant fraction of the other half of the rack heat load; the heat load to air. Water cooling enabled a compute node with 34% greater performance (Flops), resulted in a processor temperature 20–30 °C lower than that typically provided with air cooling, and reduced the power consumed in the data center to transfer the IT heat to the outside ambient by as much as 45%.
Description Author affiliation: IBM Corporation, 1 - 2455 South Rd., Poughkeepsie, NY USA 12601 (Goth, G.F.; Arvelo, A.; Ellsworth, M.J.) || IBM Corporation, 2 - 3605 Highway 52 North, Rochester, MN USA 55901 (Eagle, J.; Sinha, A.K.) || IBM Corporation, 3 - 2070 Route 52, Hopewell Junction, NY USA 12533 (Marston, K.C.; Zitz, J.A.)
ISBN 9781424495337
ISSN 10879870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2012-05-30
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
e-ISBN 9781424495320
Size (in Bytes) 1.54 MB
Page Count 10
Starting Page 700
Ending Page 709

Source: IEEE Xplore Digital Library