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Author Wong, R.L. ♦ Yeaw, C.T. ♦ Shen, S.S. ♦ Miller, J.R.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1991
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword Numerical simulation ♦ Coils ♦ Conductors ♦ Heat transfer ♦ Helium ♦ Temperature ♦ Thermal stability ♦ Inductors ♦ Numerical models ♦ Resistance heating
Abstract The stability margins of the US-Demonstration Poloidal Coil (US-DPC) and the International Thermonuclear Experimental Reactor (ITER) toroidal field (TF) coils have been modeled numerically using the computer program CICC. The computed US-DPC limiting current, I/sub lim/, compares favorably with the values determined experimentally. Using the detailed program CICC output, the authors investigated the DPC quench initiation mechanism in each of the three stability regions. In the ill-cooled region, the imposed heat pulse heats the conductor to the current-sharing temperature. In the transition region, the resistance heating after the pulse must be strong enough to overcome the induced flow reversal. In the well-cooled region, good heat transfer heats the helium during the pulse. After the pulse, these high helium temperatures along with poor heat transfer cause the conductor to quench. Changes in I/sub lim/ agree with Dresner's relationship. I/sub lim/ can be improved by decreasing the copper resistivity, the helium fraction, or the conductor diameter. Preliminary results show the ITER TF coil operating point is in the well-cooled region.<<ETX>>
Description Author affiliation: Lawrence Livermore Nat. Lab., California Univ., Livermore, CA, USA (Wong, R.L.)
ISBN 0780301323
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1991-09-30
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 412.40 kB
Page Count 5
Starting Page 326
Ending Page 330


Source: IEEE Xplore Digital Library