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Author Nigh, Phil
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2012
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Abstract A key issue is how advanced technologies are changing the way we do Testing and the Test Industry in general. There are many reports that the failure mechanisms are changing — and therefore Test much change also in response. For example, it has been reported that systematic feature-driven failures are more prevalent than physical spot defectswhich have historically been targeted during Testing. Advanced technologies are expected to drive Testing to fundamental changes in the Test process. For example, Test will assume more responsibility over time in “product personalization” — customizing each chip based on repair/redundant elements, power/performance tuning and new types of fee-dforward data. (e.g., inline test results, optical inspection data) “Adaptive Testing” will enable automated data-driven methods to optimize Quality/Reliability/Yield Loss/Test Time trad-e offs in real-time during production Testing. There are also emerging changes due to the foundry / fables semiconductor model where Testing requirements may be jointly defined among foundries, IP providers, the chip design/integrator and manufacturing test engineerin. g Clearly, there must be more data shared across companies in the End-to-End supply chain … how will this change testing? In this panel, a set of industry experts will describe their experience with advanced technoloyg nodes (32nm/28nm) and how Testing is changing for these nodes. The discussion will range from specific examples of new failures modes … to changes in Test to detect these failure modes … to broader Test process changes. The panel will also address questions like the following: · What are 1–2 examples of new failure mechanisms that you found at 32nm/28nm ? · How did you change testing because of these new defect types/failure mechanisms ? · What new method of “statistical testing” (Adaptive Testing) have you recently started using ? · 3DIC testing — is it really different ? If so, why ? · Product personalization — is this becoming more prevalent ? If so, what are the new drivers & methods ? · Power/performance optimization — is this driving major changes to the Testing process ? If so, what changes ? · Reliability defect screening — are high voltage & high temperature accelerating still effective & required ? · How should the Test industry change to drive improvements to the End-to-End Test process ? · e.g., more rapid, more detailed, real-time cross-company data sharing?
Description Author affiliation: IBM (Nigh, Phil)
ISBN 9781467315944
ISSN 10893539
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Publisher Date 2012-11-05
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
e-ISBN 9781467315951
Size (in Bytes) 101.56 kB
Page Count 4
Starting Page 1
Ending Page 4


Source: IEEE Xplore Digital Library