Thumbnail
Access Restriction
Subscribed

Author Marculescu, D. ♦ Marculescu, R. ♦ Khosla, P.K.
Sponsorship ACM ♦ EDA Consortium ♦ IEEE ♦ SSCS
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2002
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword Textiles ♦ Biomedical monitoring ♦ Remote monitoring ♦ Patient monitoring ♦ Space technology ♦ Fabrics ♦ Clothing ♦ Wearable computers ♦ Wireless communication ♦ Intelligent sensors
Abstract This paper addresses an emerging new field of research that combines the strengths and capabilities of electronics and textiles in one: electronic textiles, or e-textiles. E-textiles, also called Smart Fabrics, have not only "wearable" capabilities like any other garment, but also local monitoring and computation, as well as wireless communication capabilities. Sensors and simple computational elements are embedded in e-textiles, as well as built into yarns, with the goal of gathering sensitive information, monitoring vital statistics and sending them remotely (possibly over a wireless channel) for further processing. Possible applications include medical (infant or patient) monitoring, personal information processing systems, or remote monitoring of deployed personnel in military or space applications. We illustrate the challenges imposed by the dual textile/electronics technology on their modeling and optimization methodology.
Description Author affiliation: Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA (Marculescu, D.; Marculescu, R.; Khosla, P.K.)
ISBN 1581134614
ISSN 0738100X
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2002-06-10
Publisher Place USA
Rights Holder Association for Computing Machinery, Inc. (ACM)
Size (in Bytes) 743.61 kB
Page Count 6
Starting Page 175
Ending Page 180


Source: IEEE Xplore Digital Library