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Author Fang Bao ♦ Ke Peng ♦ Yilmaz, M. ♦ Chakrabarty, K. ♦ Winemberg, L. ♦ Tehranipoor, M.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2011
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Circuit faults ♦ Automatic test pattern generation ♦ Runtime ♦ Benchmark testing ♦ Delay
Abstract Testing for small-delay defects (SDDs) becomes necessary as technology further scales. Traditional timing-unaware transition-delay fault (TDF) ATPGs are not adequate for detecting SDDs due to sensitization of short paths. Timing-aware ATPGs suffer from multiple paths sensitization limitation and significant test design cost. % paths through a delay faults no matter the most critical path could be sensitized or not. In this paper, we present a critical fault-based methodology to generate high-quality SDD patterns. By focusing on critical faults, high quality original pattern repository could be generated applicably with $n$-detect ATPG. Novel pattern evaluation and selection method is presented to further minimize pattern count while maintaining the SDD detection ability. Finally, top-off ATPG is performed to ensure meeting the target fault coverage. Experimental results demonstrate that the proposed critical fault-based method improves long path sensitization efficiency by 2.5X and saves approximately 80\% CPU runtime compared with total fault-based method. Comparing with timing-aware ATPG, our pattern set detects equivalent or even more SDDs with significantly reduced pattern count.
ISBN 9781457704833
ISSN 15301877
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2011-05-23
Publisher Place Norway
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 417.60 kB
Page Count 6
Starting Page 177
Ending Page 182

Source: IEEE Xplore Digital Library