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Author Meixner, H.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2004
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Automotive applications ♦ Microelectronics ♦ Chemical sensors ♦ Sensor phenomena and characterization ♦ Sensor systems ♦ Manufacturing ♦ Research and development ♦ Nanostructured materials ♦ Automotive engineering ♦ Chemical technology
Abstract Whereas in the 1970s microelectronics was one of the dominant strategic research and development goals, in the 1980s materials research and information engineering had priority. Then in the early 1990s, development work was started mainly in the field of miniaturization and integration of extremely small functional units within a system, in order to open up new technologies of the future, ranging from micro- and nanostructures down to molecular and atomic units, by utilizing also phenomena of quantum physics and quantum chemistry. Sensors are of essential importance for most products and systems and for their manufacture. To some extent the development of sensors has not been able to keep pace with the tumultuous developments in microelectronic components. For this reason, sensorics is in a restructuring phase in the direction of achieving increased miniaturization and integration of sensors and signal processing within a total system. This is giving substantially more importance to technologies that permit low-cost manufacture of both the sensors and the related electronics.
Description Author affiliation: Corp. Technol., Siemens AG, Germany (Meixner, H.)
ISBN 0780386922
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2004-10-24
Publisher Place Austria
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 342.79 kB
Page Count 3
Starting Page 2
Ending Page 4

Source: IEEE Xplore Digital Library