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Author Lin, L. ♦ Kuo, F.M. ♦ Lee, C.H. ♦ Broughton, C. ♦ Yang, R. ♦ Liao, J. ♦ Wang, J.
Sponsorship Taiwan Semiconductor Ind. Assoc. ♦ IEEE Electron Devices Soc. Taipei Chapter
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2004
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Monitoring ♦ Inspection ♦ Testing ♦ Resists ♦ Costs ♦ Implants ♦ Etching ♦ Lifting equipment ♦ Power engineering and energy ♦ Cities and towns
Abstract PowerChip (PSC) Fab 12A is a newly built 300 mm DRAM fab in Taiwan. PSC Fab 12A has identified that blank wafer defect monitoring is not adequate at 300 mm due to high test wafer cost and reduced process tool productivity. Aditionally, integration defects and some tool-induced defects do not occur on blank test wafers. For these reasons PSC 12A wanted to investigate using patterned product wafers for tool monitoring. This work describes how a patterned wafer tool monitor method was implemented for ion implantation process tools using a KLA-Tencor AIT fusion darkfield defect inspection tool. The method included the use of automatic defect classification (iADC) to provide high signal to noise for the defects of interest.
Description Author affiliation: Dept. of Yield Eng., PowerChip Semicond. Corp., Hsinchu, Taiwan (Lin, L.; Kuo, F.M.; Lee, C.H.)
ISBN 0780384695
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2004-09-09
Publisher Place Taiwan
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 265.88 kB
Page Count 4
Starting Page 131
Ending Page 134


Source: IEEE Xplore Digital Library