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Author de Jong, F. ♦ Kup, B. ♦ Schuttert, R.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2000
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Pins ♦ Production ♦ Power systems ♦ Costs ♦ Circuit testing ♦ Integrated circuit testing ♦ Impedance ♦ Power supplies ♦ Circuit faults ♦ Inspection
Abstract Most modern ICs have multiple power and ground pins. It becomes necessary that all these pins are indeed connected to the board. In this paper a structural test method is presented for testing the connections of power and ground pins to the board. This on-chip test method is based on supply current detection between a bonding pad and its connection to the IC power distribution network. The method has been implemented and evaluated on a CMOS IC, using IEEE Std. 1149.1 to control and observe the embedded current sensors.
Description Author affiliation: Philips Res., Netherlands (de Jong, F.)
ISBN 0780365461
ISSN 10893539
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2000-10-05
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 882.58 kB
Page Count 10
Starting Page 575
Ending Page 584

Source: IEEE Xplore Digital Library