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Author LaBounty, C. ♦ Karim, A. ♦ Fan, X. ♦ Zeng, G. ♦ Abraham, P. ♦ Okuno, Y. ♦ Bowers, J.E.
Sponsorship Tianjin Lantian High-Tech Power Sources
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2001
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Semiconductor thin films ♦ Semiconductor lasers ♦ Vertical cavity surface emitting lasers ♦ Semiconductor laser arrays ♦ Surface emitting lasers ♦ Temperature ♦ Cooling ♦ Laser stability ♦ Pump lasers ♦ Heat pumps
Abstract We examine the cooling requirements and temperature stabilization needs of semiconductor lasers with emphasis on vertical cavity surface emitting laser (VCSEL) arrays. Semiconductor lasers in both in-plane and vertical cavity geometries are capable of generating large heat power densities of the order of kW/cm/sup 2/ over areas as small as 100 /spl mu/m/sup 2/. When cooling of the laser is needed, the cooler should be able to provide similar amounts of heat pumping. For these large amounts of heat pumping, a thin-film cooler structure is needed, especially if individual devices of an array must have precise temperature stabilization. Integration of the laser and thin film cooler by Au-Au wafer fusion is proposed. The fusion of the two interfaces is accomplished by mass transport in the deposited Au-films, which can be achieved under pressure at elevated temperatures. The quality of the fused interface is studied and preliminary experimental results are presented.
Description Author affiliation: Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA (LaBounty, C.)
ISBN 0780372050
ISSN 10942734
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2001-06-08
Publisher Place China
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 343.36 kB
Page Count 4
Starting Page 397
Ending Page 400


Source: IEEE Xplore Digital Library