Access Restriction

Author Nguyen, Vh. ♦ Castelan, P. ♦ Khatir, Z. ♦ Lebey, T. ♦ Bley, V. ♦ Sewraj, N. ♦ Luan, Qh. ♦ Schlegel, B.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2009
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Power semiconductor device ♦ Solder-less interconnections ♦ Power electronics ♦ Microelectronics ♦ Electroplating ♦ Power Integration ♦ Pressure contact ♦ Aluminum oxide ♦ Fabrication ♦ Wires ♦ AAO template ♦ Packaging ♦ Nanowires ♦ Copper ♦ Bonding ♦ Soldering ♦ Nano wires ♦ Electronics packaging
Abstract Direct Copper Bonded (DBC) bottom die substrate attachment is usually ensured by solder joints but with regard to reliability it remains the weakest component of the package. The sustained trend for high power density requires new interconnection technologies. Nano-wires seem to be a promising candidate for interconnection applications in power electronics and microelectronics [1–5]. This paper presents the fabrication process of an innovative solderless interconnection based on copper nano-wires by electroplating process, itself using the Anodic Aluminum Oxide (AAO) template. Some mechanical and electrical characterizations are investigated in order to evaluate this interconnection technology.
Description Author affiliation: Institut National de REcherche sur les Transports et leur Sécurité, 2. Av. Malleret-Joinville, 94114 Arcueil Cedex (Khatir, Z.) || Université de Toulouse, LAPLACE_Laboratoire Plasma et Conversion d'Energie, 118 route de Narbonne, F-31062 Toulouse cedex 9, France (Nguyen, Vh.; Castelan, P.; Lebey, T.; Bley, V.; Sewraj, N.; Luan, Qh.; Schlegel, B.)
ISBN 9781424444328
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2009-09-08
Publisher Place Spain
Size (in Bytes) 2.55 MB
Page Count 9
Starting Page 1
Ending Page 9

Source: IEEE Xplore Digital Library