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Author Carron, T.L. ♦ Leost, J.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2009
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Oscillators ♦ Geometry ♦ Heat transfer ♦ Temperature ♦ Solid modeling ♦ Numerical models ♦ Assembly ♦ Boundary conditions ♦ Equations ♦ Copper
Abstract The aim of this paper is to show that commercial software is able to realize an utter thermal analysis of a quartz oscillator. SOLIDWORKS files of the mechanical assembly are simplified and exported into COMSOL. Based on the assumption that under vacuum the heat transfer process is the conduction, material properties and boundary conditions are filled in the different pop-up boxes to solve the conduction equation. This paper presents results of modelisation applied to a new design which is developed by TEMEX: a new space OCXO with low consumption and low noise oscillator has been designed with this FEM modelisation.
Description Author affiliation: Advanced R&D Dpt, TEMEX, 10190 Pont Ste Marie, France (Carron, T.L.; Leost, J.)
ISBN 9781424435111
ISSN 10756787
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2009-04-20
Publisher Place France
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 833.69 kB
Page Count 5
Starting Page 482
Ending Page 486


Source: IEEE Xplore Digital Library