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Author Mulla, M. ♦ Bonde, K. ♦ Sabale, M. ♦ Thakur, S. ♦ Tonapi, S.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2014
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Substrates ♦ Flexible printed circuits ♦ Reliability ♦ Abstracts ♦ Copper ♦ Concrete ♦ Joints ♦ Equivalent plastic strain ♦ Reliability ♦ Drop impact ♦ Flip Chip on Flex ♦ Underfill ♦ Finite Element Analysis ♦ Multiple drops ♦ Von mises stress
Abstract Flip chip technology has attracted much attention in electronic industry as it fills the need for low cost, miniaturization and high performance requirements of electronic products. For such devices, package reliability under drop impact is a great concern to the manufacturers as these electronic packages are very much vulnerable to solder joint failures caused by the mechanical shock and the PCB warping upon impact. This study is performed to compare behavior of flip-chip on rigid as well as flexible substrate with and without underfill when subjected to multiple drop impact. Parametric study with variable die thickness under drop impact is also performed. Von misses stresses and equivalent plastic strain developed on electronic package when subjected to multiple drop impact are assessed and compared using Finite Element Analysis (FEA).
Description Author affiliation: Anveshak Technol. & Knowledge Solutions, Pune, India (Mulla, M.; Bonde, K.; Sabale, M.; Thakur, S.; Tonapi, S.)
ISBN 9781479952670
ISSN 10879870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2014-05-27
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 1.55 MB
Page Count 6
Starting Page 924
Ending Page 929


Source: IEEE Xplore Digital Library