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Author Arni, V.V. ♦ Huntsberger, T.L. ♦ Huntsberger, B.A.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1994
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword Acoustic materials ♦ Solid modeling ♦ Geometry ♦ Human factors ♦ Parallel algorithms ♦ Speech enhancement ♦ Acoustic diffraction ♦ Acoustic noise ♦ Working environment noise ♦ Noise generators
Abstract Acoustic properties of environments are difficult to model, due to their dependence not only on geometry, but also an the internal properties of materials (density, etc.). An acoustically accurate model that can be quantitatively validated is extremely useful for the evaluation of improved enclosures, silencers, acoustically absorbent materials, and human factors studies. We present a new parallel algorithm that generates full 3D simulations of speech intelligibility and sound pressure levels which include sound diffraction, sophisticated external noise and surface absorption models. The simulation environment interface is decoupled from the algorithm using a C++ framework running under X11R5 and Motif. The sequential version of this algorithm produced sound pressure levels that agreed with measured values on the STS-40 Space Shuttle mission to within 4%. We also present the results of some experimental studies performed using ParaSoft Express on the 56-node Intel Paragon at the University of South Carolina.
Description Author affiliation: Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA (Arni, V.V.; Huntsberger, T.L.)
ISBN 0818656808
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1994-05-23
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 617.60 kB
Page Count 6
Starting Page 623
Ending Page 628


Source: IEEE Xplore Digital Library