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Author Chew, S. ♦ Lim, E.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1996
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Monitoring ♦ Glass ♦ Dielectric loss measurement ♦ Dielectric measurements ♦ Permittivity measurement ♦ Loss measurement ♦ Mechanical variables measurement ♦ Temperature ♦ Electronics industry ♦ Calorimetry
Abstract Glass transition temperature, better known by the acronym T/sub g/ in the electronic industry, is a frequently used parameter to depict the degree of cure of epoxy encapsulant. T/sub g/ can be measured by a variety of thermal analysis techniques and often vary as the optimised conditions differ between the different techniques. This paper investigates and reports the glass transition temperature range of a cured epoxy encapsulant using differential scanning calorimetry, thermomechanical analysis and dynamic mechanical analysis.
Description Author affiliation: Inst. of Microelectron., Singapore (Chew, S.)
ISBN 0780333888
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1996-11-26
Publisher Place Malaysia
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 519.02 kB
Page Count 6
Starting Page 266
Ending Page 271

Source: IEEE Xplore Digital Library