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Author Xu Chen ♦ Jun Zhang ♦ Wang, Z.P.
Sponsorship Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2004
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Failure analysis ♦ Anisotropic conductive films ♦ Electron microscopy ♦ Absorption ♦ Temperature ♦ Semiconductor device manufacture ♦ Current ♦ Moisture measurement ♦ Humidity measurement ♦ Delamination
Abstract The objective of this work was to study the failure mechanism of anisotropic conductive film (ACF) in chip-on-glass (COG) by microscopic observation. A semiconductor thermal cycle system was designed and manufactured based on the mechanism that a semiconductor P-N joint was able to generate cool and hot with electric current variation. The device took less than 40 min to complete a thermal cycle from -40/spl deg/C to 95/spl deg/C. An on-site local microscopic observation system was set up with an electron microscope. The moisture absorption of foil-on-glass (FOG) specimens were measured under thermal cycling (-40/spl deg/C to 95/spl deg/C ), high temperature and high humidity (85/spl deg/C, 85%RH), and the ambient air (20/spl deg/C, 41%RH) conditions, respectively. The evolution of interfacial bubbles and delamination of COG specimens was observed. The experiment has shown that the moisture absorption of ACF in FOG varied with the temperature and humidity.
Description Author affiliation: Dept. of Chem. Eng. & Technol., Tianjin Univ., China (Xu Chen; Jun Zhang)
ISBN 0780383575
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2004-06-01
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 499.60 kB
Page Count 5
Starting Page 453
Ending Page 457


Source: IEEE Xplore Digital Library