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Author Lewis, J. ♦ Temple, D.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2007
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Flexible electronics ♦ Substrates ♦ Costs ♦ Consumer electronics ♦ Displays ♦ Sensor arrays ♦ Bonding ♦ Silicon ♦ Educational institutions ♦ Biological materials
Abstract We will discuss in detail the progress that has been made at RTI in developing chip-in-flex technologies, including specific applications such as sensors and implantable prostheses. We will discuss the advantages of this approach over traditional packaging techniques. We will also give an overview of related flexible electronics activities at RTI, including power, lighting, and sensor array technologies.
Description Author affiliation: RTI Int., Niles (Lewis, J.; Temple, D.)
ISBN 9781424418916
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2007-12-12
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 92.58 kB
Page Count 1
Starting Page 1
Ending Page 1

Source: IEEE Xplore Digital Library