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Author Kuo-Ning Chiang ♦ Chang-Ming Liu
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2000
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Solid modeling ♦ Predictive models ♦ Shape ♦ Closed-form solution ♦ Semiconductor device modeling ♦ Information geometry ♦ Soldering ♦ Information analysis ♦ Electronics packaging ♦ Thermal loading
Abstract In this work, a methodology of solder reflow geometry prediction for hybrid-pad-shapes (HPS) system is developed. In the reflow process, many parameters will influence the final joint shapes and there is no accurate closed-form solution for non-axisymmetric type solder pad prediction such as elliptical and rectangular pads. However, conventional approach like energy-based simulation model for predicting geometries in multiple/hybrid joint arrays is very difficult and time consuming. This work presents an approach combining the analytical and the energy-based methods and is capable of solving any kind of HPS system, such as round, elliptical, and rectangular pads. Furthermore, a detailed geometry information of the solder joints can be transferred to any conventional pre-processor/solver such as MSC/PATRAN, MSC/NASTRAN, LS-DYNA3D, ABAQUS and ANSYS for reliability analyses. The objective of this work for predicting multiple/hybrid solder reflow geometries in ball grid array type interconnects is to achieve optimal joint geometries from the standpoint of improved yield and better reliability cycles under thermal loading. Furthermore, results presented in this study can be used as a reference for area array interconnects design.
Description Author affiliation: Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan (Kuo-Ning Chiang)
ISBN 0780359127
ISSN 10899870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2000-05-23
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 477.30 kB
Page Count 9
Starting Page 340
Ending Page 348

Source: IEEE Xplore Digital Library