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Author Younan, H. ♦ Eddy, C. ♦ Redkar, S.
Sponsorship Mems Technol.(M) Sdn, Bhd ♦ Kriptic Devices (M) Sdn Bhd ♦ IEEE Electron Devices Soc
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2002
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Wafer bonding ♦ Corrosion ♦ Galvanizing ♦ Failure analysis ♦ Sawing ♦ Inspection ♦ Assembly ♦ Numerical analysis ♦ Anodes ♦ Cathodes
Abstract In this paper, a case of discolored bondpad is discussed. Failure analysis results showed the discoloration of bondpads was due to pinholes and Si dust around the pinholes. which were introduced during the wafer die sawing process caused by galvanic corrosion. Failure mechanism and characteristics of galvanic corrosion on Aluminium bondpads have been studied in this paper.
Description Author affiliation: Chartered Semicond. Manuf. Ltd., Singapore, Singapore (Younan, H.; Eddy, C.; Redkar, S.)
ISBN 0780375785
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2002-12-19
Publisher Place Malaysia
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 528.27 kB
Page Count 5
Starting Page 383
Ending Page 387

Source: IEEE Xplore Digital Library