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Author Kottke, P.A. ♦ Yun, T.M. ♦ Green, C.E. ♦ Joshi, Y.K. ♦ Fedorov, A.G.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©2014
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Coolants ♦ Heat transfer ♦ Friction ♦ Thermodynamics ♦ Hidden Markov models ♦ Market research ♦ Mathematical model ♦ microgap ♦ microelectronics cooling ♦ microchannel boiling heat transfer
Abstract We present results of modeling for the design of microgaps for the removal of high heat fluxes, i.e., 1 $kW/cm^{2},$ at low wall temperature (~ 85°C) via a strategy of very high mass flux (>1000 $kg/m^{2}s),$ high quality (outlet vapor mass quality >90%), two-phase forced convection. Modeling includes (1) thermodynamic analysis to obtain performance trends across a wide range of candidate coolants, (2) evaluation of worst-case pressure drop due to contraction and expansion in inlet/outlet manifolds, and (3) 1-D reduced order simulations to obtain realistic estimates of different contributions to the pressure drops. The main result is the identification of a general trend of improved heat transfer performance at higher system pressure at the cost of reduced achievable system efficiency (COP), with important implications for coolant selection and system design.
Description Author affiliation: George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Kottke, P.A.; Yun, T.M.; Green, C.E.; Joshi, Y.K.; Fedorov, A.G.)
ISBN 9781479952670
ISSN 10879870
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2014-05-27
Publisher Place USA
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 558.88 kB
Page Count 6
Starting Page 199
Ending Page 204

Source: IEEE Xplore Digital Library