Thumbnail
Access Restriction
Subscribed

Author Kleiner, M.B. ♦ Kuehn, S.A. ♦ Haberger, K.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1995
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Cooling ♦ Microchannel ♦ Heat sinks ♦ Thermal resistance ♦ Coolants ♦ Heat pumps ♦ Design optimization ♦ Copper ♦ Assembly ♦ Silicon
Abstract In this work a high performance air cooling scheme based on microchannel parallel plate-fin heat sinks, in which the coolant is ducted to and optionally from the heat sink through tubes, is theoretically and experimentally investigated. The performance in terms of thermal resistance, pressure drop, and pumping power is modeled as a function of heat sink dimensions, tube dimensions, and air flow rate. Optimizations are performed and design trade-offs discussed. A specimen heat sink with lateral dimensions of 5 cm/spl times/5 cm, with 150 /spl mu/m thick fins, and with 300 /spl mu/m wide channels was fabricated using copper foils and a simple assembly process. The performance of the heat sink was evaluated experimentally. A thermal resistance of approximately 0.2 K/W is achieved at a pressure drop of 12.5 mbar and an air flow rate of 5 l/s. The agreement between predicted and experimental results is found to be comparatively good. Results of the present study are compared to results of other investigations concerning direct air cooling. The achievable thermal performances using the investigated cooling approach are superior to those attainable using conventional air cooling schemes as well as to those employing silicon microcoolers.
Description Author affiliation: Corp. Res. & Dev., Siemens AG, Munich, Germany (Kleiner, M.B.; Kuehn, S.A.)
ISBN 078032434X
ISSN 10652221
Educational Role Student ♦ Teacher
Age Range above 22 year
Educational Use Research ♦ Reading
Education Level UG and PG
Learning Resource Type Article
Publisher Date 1995-02-07
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Size (in Bytes) 913.55 kB
Page Count 9
Starting Page 122
Ending Page 130


Source: IEEE Xplore Digital Library