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Author Lee, Jinho ♦ Kang, Kyungsu ♦ Choi, Kiyoung
Source ACM Digital Library
Content type Text
Publisher Association for Computing Machinery (ACM)
File Format PDF
Copyright Year ©2015
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword 3D stacking ♦ NoC ♦ Deadlock ♦ Routing algorithm
Abstract 3D integrated circuits (3D ICs) using through-silicon vias (TSVs) allow to envision the stacking of dies with different functions and technologies, using as an interconnect backbone a 3D $\textit{network-on-chip}$ (NoC). However, partial vertical connection in 3D NoCs seems unavoidable because of the large overhead of TSV itself (e.g., large footprint, low fabrication yield, additional fabrication processes) as well as the heterogeneity in dimension. This article proposes an energy-efficient deadlock-free routing algorithm for 3D mesh topologies where vertical connections partially exist. By introducing some rules for selecting elevators (i.e., vertical links between dies), the routing algorithm can eliminate the dedicated virtual channel requirement. In this article, the rules themselves as well as the proof of deadlock freedom are given. By eliminating the virtual channels for deadlock avoidance, the proposed routing algorithm reduces the energy consumption by 38.9% compared to a conventional routing algorithm. When the virtual channel is used for reducing the head-of-line blocking, the proposed routing algorithm increases performance by up to 23.1% and 6.9% on average.
Description Author Affiliation: Seoul National University, Seoul, South Korea (Lee, Jinho; Choi, Kiyoung); Samsung, Gyeonggi-do, Korea (Kang, Kyungsu)
ISSN 15504832
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2015-09-01
Publisher Place New York
e-ISSN 15504840
Journal ACM Journal on Emerging Technologies in Computing Systems (JETC)
Volume Number 12
Issue Number 3
Page Count 22
Starting Page 1
Ending Page 22


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Source: ACM Digital Library