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Author Rao, C. R. K. ♦ MaIathy, P.
Source CSIR-Central Electrochemical Research Institute
Content type Text
Publisher Society for Advancement of Electrochemical Science and Technology
File Format PDF
Copyright Year ©2000
Language English
Subject Domain (in DDC) Technology ♦ Chemical engineering
Subject Keyword Industrial Metal Finishing
Abstract The elctrodeposition behavior ofplatinum from the Pt[(NH) H20U+2 complex bath was investigated on copper and titanium panels and the deposits were characterised by SEM, XRF and XRD techniques. The current effici ncies for the deposition process were examined. The bath deposits bright and adherent coatings. Th bath operates at lower temperatures than the Q-bath.
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2000-01-01
Journal PeerReviewed