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Author Balasubramanian, A. ♦ Srikumar, D. S. ♦ Raja, G. ♦ Saravanan, G. ♦ Mohan, S.
Source CSIR-Central Electrochemical Research Institute
Content type Text
Publisher Maney
File Format PDF
Copyright Year ©2009
Language English
Subject Domain (in DDC) Technology ♦ Chemical engineering
Subject Keyword Industrial Metal Finishing
Abstract The pulsed electrodeposition of copper on stainless steel has been studied in copper sulphate bath and the effect of duty cycle and frequency on the thickness and current efficiencies were compared at 50uC and at room temperature with average current density of 4 A dm22. A new strike bath based on cupric chloride and hydrochloric acid was developed for the first time. The Cu coatings were characterised by SEM, AFM and XRD. Crystallite sizes of Cu coatings were calculated for various duty cycles from the Scherer’s equation. The deposits were smaller nodules and fine grained.
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2009-01-01
Journal PeerReviewed