|Author||Lehman, E. B. ♦ Bonarski, K. ♦ Swiatek, Z. ♦ Rameshbapu, G. N. K.|
|Source||CSIR-Central Electrochemical Research Institute|
|Publisher||Central Electrochemical Research Institute|
|Subject Domain (in DDC)||Technology ♦ Chemical engineering|
|Subject Keyword||Industrial Metal Finishing|
|Abstract||Electrodeposition is the most widely used electrochemical surface treatment process for fabrication of functional and decorative coatings. Electrochemical and hydrodynamic parameters of the electrodeposition process and substrdte texture affect the formation of layers of texture and consequently, tbe pbysical and mechanical properties of coating associated with their anisotropy. The uniformity and structure of electroplated metals also strongly depend on the deposition kinetics (charge transfer reaction or mass transport conlrol), which detemlines the conditions of cathode deposit formation and consequently the crystallites orientation. The present work aims to investigate the influence of Cu substrate texture on developing of it in the copper coating electrodeposited under activation control as tbe simple model system for the first stage of thjs study. The texture analysis was performed on the basis of the back-renection pole figures and of ones with a constant information depth, measured by means of X-ray technique. The non-destructive method allowed to analyse the texture for different chosen areas of the deposited layer. The results show the existing texture inhomogenity. The texture of the substrate reveals a strong influence on the texture of the formed Cu layer in its near-interface area. As far as depositing from withdraws from the substrate surface, the texture proceeds to ,3 one component of axis type of (Ill) uvw.|
|Education Level||UG and PG|
|Learning Resource Type||Article|
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