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Author Yoo, S.K. ♦ Ge Wang ♦ Collison, F. ♦ Rubinstein, J.T. ♦ Vannier, M.W. ♦ Kim, H.-J. ♦ Kim, N.H.
Sponsorship IEEE Engineering in Medicine and Biology Society
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1964
Language English
Subject Domain (in DDC) Technology ♦ Medicine & health ♦ Engineering & allied operations
Subject Keyword Cochlear implants ♦ Electrodes ♦ X-ray imaging ♦ Numerical simulation ♦ Ear ♦ Speech processing ♦ Three dimensional displays ♦ Spirals ♦ Computed tomography ♦ Geometry
Abstract Three-dimensional (3-D) localization of individual cochlear implant electrodes within the inner ear is of importance for modeling the electrical field of the cochlea, designing the electrode array, and programming the associated speech processor. A 3-D reconstruction method of cochlear implant electrodes is proposed to localize individual electrodes from two X-ray views in combination with the spiral computed tomography technique. By adapting epipolar geometry to the configuration of an X-ray imaging system, we estimate individual electrode locations in the least square sense without using a patient attachment required by an existing stereophotogrammetry technique. Furthermore, our method does not require any knowledge of the intrinsic and extrinsic parameters of the imaging system. The performance of our method is studied in numerical simulation and with patient data and is found to be sufficiently accurate for clinical use. The maximum root mean-square errors measured are 0.0445 and 0.214 mm for numerical simulation and patient data, respectively.
Description Author affiliation :: Dept. of Med. Eng., Yonsci Univ., Seoul, South Korea
ISSN 00189294
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2004-05-01
Publisher Place U.S.A.
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Volume Number 51
Issue Number 5
Size (in Bytes) 312.20 kB
Page Count 9
Starting Page 838
Ending Page 846

Source: IEEE Xplore Digital Library