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Author Kondo, Kazuo ♦ Uno, Katsumasa ♦ Shinohara, Kunio ♦ Fukui, Keisuke
Sponsorship USDOE
Source United States Department of Energy Office of Scientific and Technical Information
Content type Text
Language English
Subject Keyword MATERIALS SCIENCE ♦ ENGINEERING NOT INCLUDED IN OTHER CATEGORIES ♦ COPPER ♦ ELECTRODEPOSITION ♦ ELECTRODEPOSITED COATINGS ♦ MORPHOLOGY ♦ FLUID MECHANICS ♦ MICROELECTRONICS
Abstract The initial stage of bumps was electrodeposited at diffusion control overvoltage. Their shapes were observed by scanning electron microscopy and are discussed with numerical fluid dynamics computation. The bumps were electrodeposited either by varying the Peclet numbers or by varying dot diameters. For the Peclet number of 1.31 with 100 {micro}m dot diameter, the bump shows a maximum height hump at the circumference of upstream side and a lower hump exists at the downstream side. For 41.6, however, the hump at the upstream side slightly shifts to downstream and the hump becomes flat at the downstream side. The bump shows a maximum height at the upstream side for 200, 100, and 30 {micro}m in dot diameter for the Peclet number of 1.31. A lower hump exists at the downstream side. The bump shapes become flat for 15, 10, and 5 {micro}m dot diameters. These observed bump shapes are explained by the fluid dynamics calculations of vortex evolution and penetration flow. The calculated flux profiles coincide well with observed bump shapes.
ISSN 00134651
Educational Use Research
Learning Resource Type Article
Publisher Date 1996-06-01
Publisher Place United States
Journal Journal of the Electrochemical Society
Volume Number 143
Issue Number 6


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