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Author Matrone, G. ♦ Savoia, A.S. ♦ Terenzi, M. ♦ Caliano, G. ♦ Quaglia, F. ♦ Magenes, G.
Source IEEE Xplore Digital Library
Content type Text
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
File Format PDF
Copyright Year ©1986
Language English
Subject Domain (in DDC) Natural sciences & mathematics ♦ Physics ♦ Electricity & electronics ♦ Technology ♦ Engineering & allied operations ♦ Applied physics
Subject Keyword Receivers ♦ MATLAB ♦ Integrated circuit modeling ♦ Imaging ♦ Mathematical model ♦ Transducers ♦ Capacitors
Abstract In modern ultrasound imaging devices, two-dimensional probes and electronic scanning allow volumetric imaging of anatomical structures. When dealing with the design of such complex 3-D ultrasound (US) systems, as the number of transducers and channels dramatically increases, new challenges concerning the integration of electronics and the implementation of smart micro-beamforming strategies arise. Hence, the possibility to predict the behavior of the whole system is mandatory. In this paper, we propose and describe an advanced simulation tool for ultrasound system modeling and simulation, which conjugates the US propagation and scattering, signal transduction, electronic signal conditioning, and beamforming in a single environment. In particular, we present the architecture and model of an existing 16-channel integrated receiver, which includes an amplification and micro-beamforming stage, and validate it by comparison with circuit simulations. The developed model is then used in conjunction with the transducer and US field models to perform a system simulation, aimed at estimating the performance of an example 3-D US imaging system that uses a capacitive micromachined ultrasonic transducer (CMUT) 2-D phased-array coupled to the modeled reception front-end. Results of point spread function (PSF) calculations, as well as synthetic imaging of a virtual phantom, show that this tool is actually able to model the complete US image reconstruction process, and that it could be used to quickly provide valuable system-level feedback for an optimized tuning of electronic design parameters.
Description Author affiliation :: STMicroelectron., Cornaredo, Italy
Author affiliation :: Univ. degli Studi di Pavia, Pavia, Italy
Author affiliation :: Dipt. di Ing., Univ. degli Studi Roma Tre, Rome, Italy
ISSN 08853010
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2014-01-01
Publisher Place U.S.A.
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Volume Number 61
Issue Number 5
Size (in Bytes) 4.20 MB
Page Count 13
Starting Page 792
Ending Page 804

Source: IEEE Xplore Digital Library