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Author Massoud, Yehia ♦ Nieuwoudt, Arthur
Source ACM Digital Library
Content type Text
Publisher Association for Computing Machinery (ACM)
File Format PDF
Copyright Year ©2006
Language English
Subject Domain (in DDC) Computer science, information & general works ♦ Data processing & computer science
Subject Keyword Carbon nanotube ♦ Inductance ♦ Interconnect ♦ Nanotube bundle ♦ Resistance
Abstract Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper interconnect as technology scales into the nanoscale regime. In this article, we evaluate the performance and reliability of nanotube bundles for both local and global interconnect in future VLSI applications. To provide a holistic evaluation of SWCNT bundles for on-chip interconnect, we have developed an efficient equivalent circuit model that captures the statistical distribution of individual metallic and semiconducting nanotubes while accurately incorporating recent experimental and theoretical results on inductance, contact resistance, and ohmic resistance. Leveraging the circuit model, we examine the performance and reliability of nanotube bundles for both individual signal lines and system-level designs. SWCNT interconnect bundles can provide significant improvement in delay and maximum current density over traditional copper interconnect, depending on bundle geometry and process technology. However, for system-level designs, the statistical variation in the delay of SWCNT bundles may lead to reliability issues in future process technology. Consequently, if the SWCNT chirality can be effectively controlled and other manufacturing challenges are met, SWCNT bundles potentially are a viable alternative to standard copper interconnect as process technology scales.
ISSN 15504832
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2006-07-01
Publisher Place New York
e-ISSN 15504840
Journal ACM Journal on Emerging Technologies in Computing Systems (JETC)
Volume Number 2
Issue Number 3
Page Count 42
Starting Page 155
Ending Page 196


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Source: ACM Digital Library