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Author Selen, Veyis ♦ Özer, Dursun ♦ Özer, Ahmet
Source SpringerLink
Content type Text
Publisher Springer Berlin Heidelberg
File Format PDF
Copyright Year ©2014
Language English
Subject Domain (in DDC) Technology ♦ Engineering & allied operations
Subject Keyword Cr(VI) ions ♦ Dehydrated sesame (Sesamum indicum) stems (DSS) ♦ Adsorption ♦ Kinetics ♦ Thermodynamic parameters ♦ Engineering ♦ Science
Abstract An alternative, low-cost absorbent is needed to replace other, expensive treatment methods for removing Cr(VI) from wastewater. The removal of Cr(VI) ions from aqueous solution onto dehydrated sesame (Sesamum indicum) stems (DSS) has been investigated using a batch adsorption technique. In such solutions, the influence of various experimental parameters, such as contact time, initial pH, initial concentration of Cr(VI) ions, and temperature, has been evaluated, and the adsorption process was found to be highly dependent on pH. The optimum, initial pH for the removal of chromium ions was found to be 1.5. Pseudo-first-order and pseudo-second-order rate equations were tested on the kinetic data, and the adsorption process was found to follow pseudo-second-order rate kinetics. The Langmuir and Freundlich isotherm models were applied to the experimental equilibrium data depending on temperature, and the isotherm constants were determined by using nonlinear regression analysis. Equilibrium data were represented better by the Langmuir model than the Freundlich model. The monolayer coverage capacities of DSS were calculated as 189.1 and 217.4 mg/g at 20 and 50 °C, respectively. Thermodynamic studies showed that the adsorption of Cr(VI) ions onto (DSS) was endothermic in nature.
ISSN 13198025
Age Range 18 to 22 years ♦ above 22 year
Educational Use Research
Education Level UG and PG
Learning Resource Type Article
Publisher Date 2014-07-04
Publisher Place Berlin, Heidelberg
e-ISSN 21914281
Journal Arabian Journal for Science and Engineering
Volume Number 39
Issue Number 8
Page Count 10
Starting Page 5895
Ending Page 5904

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Source: SpringerLink