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Author De Pasquale, Giorgio ♦ Somà, Aurelio ♦ Ballestra, Alberto
Source arXiv.org
Content type Text
File Format PDF
Date of Submission 2008-05-07
Language English
Subject Domain (in DDC) Computer science, information & general works
Subject Keyword Computer Science - Other Computer Science ♦ cs
Abstract The effect of mechanical fatigue on structural performances of gold devices is investigated. The pull-in voltage of special testing micro-systems is monitored during the cyclical load application. The mechanical collapse is identified as a dramatic loss of mechanical strength of the specimen. The fatigue limit is estimated through the stair-case method by means of the pull-in voltage measurements. Measurements are performed by means of the optical interferometric technique.
Description Reference: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
Educational Use Research
Learning Resource Type Article


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